Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials | JoVE Visualize

Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials

Valeria V Belloni^1,2, Monica Bollani³, Shane M Eaton⁴

¹Dipartimento di Scienza e Alta Tecnologia, Università degli Studi dell'Insubria, Via Valleggio 11, 22100 Como, Italy.

Micromachines|April 30, 2021

View abstract on PubMed

Summary

This study demonstrates picosecond Bessel beam laser micromachining for creating precise through-holes in transparent materials like glass and polymers. The trepanning technique enables efficient micro-drilling without scanning, offering advantages for various dielectric applications.

Area of Science:

Materials Science
Optical Engineering
Laser Physics

Background:

Micro-drilling transparent materials is crucial for applications in optics and electronics.
Conventional laser drilling often requires scanning along the sample thickness, increasing complexity.
Non-diffracting beams offer potential for improved drilling processes.

Purpose of the Study:

To investigate the efficacy of picosecond pulsed Bessel beams combined with trepanning for micro-drilling transparent dielectrics.
To analyze the generated through-hole characteristics across various materials and thicknesses.
To evaluate the advantages and limitations of this laser micromachining technique.

Main Methods:

Utilized picosecond pulsed Bessel beams and the trepanning technique for laser micromachining.
Applied the process to diverse transparent dielectric materials including glass, polymers, and diamond.
Examined through-hole morphology, features, and aspect ratios.

Main Results:

Successfully created through-apertures with micrometer-scale diameters in materials ranging from 200 to 500 micrometers thick.
Demonstrated the technique's applicability to materials with varying thermal and mechanical properties.
Highlighted material-specific advantages and drawbacks, including hole quality and aspect ratio.

Conclusions:

Picosecond Bessel beam laser micromachining with trepanning is a viable method for efficient through-hole fabrication in transparent dielectrics.
The technique offers precise control over aperture dimensions and quality.
Further optimization is possible for specific materials like glass, particularly at the output interface.